Microsoft releases details on their HPU (Holographic Processing Unit), their custom chip for processing sensor data in their HoloLens headset.

Microsoft's HoloLens secret sauce: A 28nm 24-core DSP custom brain built by TSMC

Hot Chips Microsoft today revealed a first look at the inside of its Holographic Processing Unit chip used in its virtual reality HoloLens specs. The HPU is a custom-designed TSMC-fabricated 28nm coprocessor that has 24 Tensilica DSP cores. It has about 65 million logic gates, 8MB of SRAM and 1GB of low-power DDR3 RAM, all in a 12mm by 12mm BGA package.

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Microsoft's HPU is the chip that makes the HoloLens possible. Rather than bogging down the CPU or GPU with the additional processing, Microsoft instead design a custom chip set they named the HPU. The tech behind HoloLens is really exciting and will completely change the way we think about computers with a completely new way to compute in out world.